To usher in the evolution of the Dimensity 900 and Dimensity 800, MediaTek has unveiled two new chipsets – the Dimensity 920 and Dimensity 810. Both chipsets are built on TSMC’s (Taiwan Semiconductor Manufacturing Company) 6nm manufacturing process.
The Dimensity 920 and 810 chips feature Octa-core CPUs and support an FHD+ display with a 120Hz refresh rate which suggests that they are intended for mid-range phones, maybe upper mid-range.
The Dimensity 920 features powerful Cortex-A78 cores running at 2.5GHz speed with the Cortex-A55 cores clocked at 2GHz speed. The GPU featured on the chip is a Mali-G68 MC4 which the company proclaims to be an optimized design for power efficiency and offers up to 9% faster gaming performance over its predecessor – the Dimensity 900. The Dimensity 920 chip gives phone makers flexibility by supporting LPDDR4x and LPDDR5 RAM, as well as UFS 2.2 and UFS 3.1 storage. The chip also supports Dual 5G SIM connectivity and VoNR service. Some of its key specs include all the latest Wi-Fi standards, Bluetooth 5.2 and 2×2 MIMO.
The Dimensity 810 chip is the first 6nm chipset in the Dimensity 800 series and offers a dual 5G stand-by. It features older Cortex-A76 CPU cores which clock at 2.4GHz and Cortex-A55 power-efficient cores of unconfirmed speed. GPU-wise, the chip has a Mali-G57 MC2 GPU and supports LPDDR4x RAM and UFS 2.2 storage.
The MediaTek Dimensity 920 and Dimensity 810 are expected to be available in smartphones as early as the third quarter (Q3) of 2021. But for now, no phone company has announced plans to use the chipsets.
