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HomeNewsRedmi K70 Ultra Teased for July Release; Retail Box Image Unveiled

Redmi K70 Ultra Teased for July Release; Retail Box Image Unveiled

Today, Redmi General Manager Wang Teng Thomas released a video on Weibo, providing an update on the highly anticipated Redmi K70 Ultra. In the video, he conversed with Xiaomi founder and CEO Lei Jun, discussing the final preparations for the K70 Ultra’s launch.

Wang Teng Thomas revealed that the Redmi K70 Ultra, like its predecessor, the Redmi K60 Ultra, will be a performance-focused device, poised to become the “performance king” within the 3,000 Yuan (~$412) price range. Reports indicate that the K70 Ultra will feature the Dimensity 9300 Plus chipset, the same powerful processor found in the recently launched iQOO Neo 9S Pro in China.

In addition to the main chip, Wang Teng Thomas mentioned that the K70 Ultra will include a powerful independent graphics chip and an advanced ice-sealed cooling system. On Friday, he also shared a sneak peek of the device’s retail box.

The Redmi K70 Ultra will be an IP68-rated dustproof and water-resistant device, featuring a flat 8T OLED panel with a 1.5K resolution and a 144Hz refresh rate. For enhanced durability, the phone will come with a metal middle frame.

The Dimensity 9300 Plus-powered phone is said to include up to 24 GB of LPDDR5x RAM, 1 TB of UFS 4.0 storage, and a 5,500mAh battery with 120W fast charging. Camera-wise, it might include a 20-megapixel front camera for selfies and a triple camera configuration on the back with 50-megapixel, 8-megapixel, and 2-megapixel sensors.

Additionally, a tweaked version of the Redmi K70 Ultra, featuring improved cameras, is anticipated to launch globally under the Xiaomi 14T Pro moniker in the coming weeks.

Abubakar
Abubakarhttps://phonecorridor.com
Tech Blogger and Video Producer. Passionate about smartphones and other consumer technology. If I'm not writing or editing a video I'm out there enjoying soccer with friends.