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HomeNewsMediaTek Announces the Dimensity 8200 Flagship Level Chipset

MediaTek Announces the Dimensity 8200 Flagship Level Chipset

MediaTek has announced their new Dimensity 8200 which is a new flagship-level chipset. It is expected to bring premium-level experience to smartphones in 2023. The chipset is built on a 4nm process technology and it comes with HyperEngine 6.0 supported by Vulkan SDK for raytracing in games. It will also bring improvements in smart resource optimization and FPS over it predecessors-the Dimensity 8000 and 8100.

The Dimensity 8200 comes with a big CPU core, and it’s the first chipset from the series to come with such. It comes with the Cortex-A78 at 3.1 GHz, three more at 3.0 GHz for performance, and four Cortex-A55 at 2.0 GHz for efficiency. They also brought improved camera support on the chipset and Imagiq 785 ISP. The new chipset will allow HyperEngine, a set of new features that will allow for better gaming performance in smartphones. It is expected that the new processor will be used in mostly flagship killer phones.

The Phones powered by The MediaTek Dimensity 8200 will adapt their refresh rate when a game is running. It is expected that the chipset will adapt automatically when a game is running.

Read More-Tecno Phantom X2 Pro and X2 Unveiled With MediaTek Dimensity 9000

MediaTek Dimensity 8200 – Connectivity and More

The chipset is going to come with dual 5G connectivity, Bluetooth 5.3, Wi-Fi 6E, and downlink speed. It will be up to manufacturers to give you the best from the chipset on their upcoming phones.

The IQOO Neo7 SE was announced earlier in China and it’s the first phone to be powered by the chipset. It is also expected that the upcoming Xiaomi Redmi K60E will be powered by the chipset.

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Tech Blogger and Video Producer. Passionate about smartphones and other consumer technology. If I'm not writing or editing a video I'm out there enjoying soccer with friends.


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