Qualcomm’s Snapdragon Tech Summit 2018 formally began yesterday with some key 5G-related announcements coming from Qualcomm and its partners. One of these was the launch of the Qualcomm Snapdragon 855, anticipated to feature on mobile devices soon.
Previous rumors hinted that this latest chip would not be unveiled with the name, “Snapdragon 8150”, and this speculation has now been confirmed to be valid on the heels of the announcement yesterday.
This recent 7nm process is expected to provide significantly better battery life and improved phone performance. During the announcement, improvements to AI performance were equally revealed, when SVP and General Manager of mobile at Qualcomm, Alex Katouzian, said the latest release will have “up to three times the AI performance compared to the previous generation mobile platform.”
The part offers a new dedicated vision processor, capable of processing depth mapping at 60 frames in one second. This feature should noticeably enhance augmented reality applications. Also, the new image processor supports 4K HDR capture at 60 fps, with only 25 percent of the power previously utilized.
There were 2 other things announced also at this event. The first one was the ultrasonic in-display fingerprint, which the manufacturer calls the “Qualcomm 3D Sonic Sensor”. This component has the ability to detect your fingerprint if it’s bristled with particles or wet.
The second component announced had to do with 5G. The company is not exactly including an X50 modem into all the new Snapdragon 855 chips it is designing. Rather than doing this, the latest chip will be integrated with Qualcomm’s new X24 LTE modem, which can offer (theoretical) download speeds that are up to 2Gbps.
We can anticipate this Qualcomm’s new processor to power flagships, from all the major smartphone players, including the Samsung Galaxy S10 and other 5G-enabled devices that are billed to be released in the first half of 2019.
